PART |
Description |
Maker |
AM29827DM AM29828DM AM29828PCB AM29828ADC AM29828A |
Intelligent Power Switch Single/Dual Channel Low Side Driver in a SOT-223 Package; A IPS1041LPBF with Standard Packaging 600V Non Punch Through, Short Circuit Rated IGBT in a D-Pak package.; Similar to IRGR3B60KD2 with Lead Free Packaging 600V UltraFast 10-30 kHz Copack IGBT in a TO-220AB package; Similar to IRGB10B60KD with Lead Free Packaging 600V UltraFast 10-30 kHz Copack IGBT in a TO-262 package; Similar to IRGSL10B60KD with Lead Free Packaging Intelligent Power Switch 1 Channel Low Side Driver in a D-Pak Package; A IPS1031R with Standard Packaging Intelligent Power Switch Single/Dual Channel Low Side Driver in an SO-8 Package; A IPS1052GPBF with Standard Packaging 600V Fast 1-8 kHz Copack IGBT in a TO-220AB package; Similar to IRG4BC20MD with Lead Free Packaging 600V UltraFast 8-25 kHz Copack IGBT in a D2-Pak package; A IRG4BC20KD-S with Standard Packaging 600V UltraFast 8-25 kHz Copack IGBT in a TO-247AC package; A IRG4PC30KD with Standard Packaging Intelligent Power Switch 1 Channel High Side Driver in a SO-8 Package; A IPS7091GPBF with Standard Packaging Programmable Current Sense High Side Switch in a 5-Lead D2-Pak Package; A IR3314SPBF with Standard Packaging Intelligent Power Switch Single/Dual Channel Low Side Driver in a SOT-223 Package; A IPS1051LPBF with Standard Packaging Intelligent Power Switch 1 Channel Low Side Driver in a D2-Pak Package; A IPS1031S with Standard Packaging Intelligent Power Switch 1 Channel High Side Driver in a TO-220 Package; A IPS7091PBF with Standard Packaging Intelligent Power Switch 1 Channel High Side Driver in a D2-Pak Package; A IPS6031SPBF with Standard Packaging Intelligent Power Switch 1 Channel High Side Driver in a SO-8 Package; A IPS6041GPBF with Standard Packaging 600V UltraFast 8-60 kHz Copack IGBT in a TO-247AC package; A IRG4PC50UD with Standard Packaging 600V UltraFast 8-60 kHz Copack IGBT in a TO-247AC package; Similar to IRG4PC50UD with Lead Free Packaging Programmable Current Sense High Side Switch in a 5-Lead TO-220 Package; A IR3315PBF with Standard Packaging 10位缓冲器/驱动 10-Bit Buffer/Driver 10位缓冲器/驱动
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Fairchild Semiconductor, Corp. Advanced Micro Devices, Inc.
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PSR54-9P PSA55-9R PSA55-7I PSR53-7R PSR53-9P PSR53 |
60V Single N-Channel Hi-Rel MOSFET in a TO-204AE package; A IRF054 with Standard Packaging Analog IC Fully optimized solution for high current synchronous buck multiphase applications in a LGA power block.; Similar to the iP2003A in Tape and Reel packaging. 500V Single N-Channel Hi-Rel MOSFET in a TO-259AA package; A IRFI460 with Standard Packaging 400V Single N-Channel Hi-Rel MOSFET in a TO-257AA package; A IRFY340CM with Standard Packaging Synchronous Buck Multiphase Optimized BGA Power Block.; Tape and Reel version of the iP2002 -100V Single P-Channel Hi-Rel MOSFET in a 18-pin LCC package; A IRFE9110 with Standard Packaging Synchronous Buck Multiphase Optimized BGA Power Block.; A IP2002 with Standard Packaging -100V Single P-Channel Hi-Rel MOSFET in a TO-205AF package; A JANTXV2N6845 with Standard Packaging 模拟IC Dual Output Full Function 2 Phase Synchronous Buck Power Block, Integrated Power Semiconductors, PWM Controller and Passives.; A IP1202 with Standard Packaging 模拟IC
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TE Connectivity, Ltd.
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87914-2815 0879142815 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75μm (30μ) Gold (Au) Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75渭m (30渭) Gold (Au) Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75楼矛m (30楼矛) Gold (Au) Plating, Tray Packaging, Lead-free
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Molex Electronics Ltd.
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87797-0010 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row Dual Body, Vertical, 34 Circuits, Tin (Sn) Overall Plating, 15.10mm (.594) Stacking Height, Tray Packaging
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Molex Electronics Ltd.
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E142-SERIES M342-SERIES T242-SERIES X242-SERIES E2 |
Transient Voltage Suppressor Diodes 100V Single N-Channel HEXFET Power MOSFET in a D-Pak package; A IRFR3910 with Standard Packaging 30V Single N-Channel HEXFET Power MOSFET in a SO-8 package; A IRF7862PBF with Standard Packaging 30V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; A IRL2203NS with Standard Packaging 200V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; A IRFB260N with Standard Packaging 30V Single N-Channel HEXFET Power MOSFET in a SO-8 package; A IRF9410 with Standard Packaging 250V Single N-Channel HEXFET Power MOSFET in a I-Pak package; Similar to IRFU12N25D with Lead Free Packaging 55V Single N-Channel HEXFET Power MOSFET in a D-Pak package; A IRLR4343 with Standard Packaging Peripheral IC 外围芯片
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Bourns, Inc. Hoffman TOKO, Inc.
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AM29F400AB-150FEB AM29F400AT-150FE AM29F400AT-150S |
55V Single N-Channel HEXFET Power MOSFET in a D2Pak Package; A IRF3205ZS with Standard Packaging 75V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; A IRFB3307 with Standard Packaging 55V Single N-Channel HEXFET Power MOSFET in a TO-262 package; A IRF1010ZL with Standard Packaging 55V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; A IRF1010Z with Standard Packaging 30V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; A IRF3707 with Standard Packaging x8/x16 Flash EEPROM 75V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; Similar to IRF1407 with Lead Free Packaging 100V Single N-Channel HEXFET Power MOSFET in a I-Pak package; A IRLU120N with Standard Packaging x8/x16闪存EEPROM
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Advanced Micro Devices, Inc.
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K75-29A K75-48M K75-82 K75-15 K75-80 K75-54 K78-10 |
Aluminum Snap-In Capacitor; Capacitance: 10000uF; Voltage: 35V; Case Size: 30x30 mm; Packaging: Bulk Aluminum Snap-In Capacitor; Capacitance: 22000uF; Voltage: 35V; Case Size: 35x45 mm; Packaging: Bulk FILM AND PAPER-FILM CAPACITORS Aluminum Snap-In Capacitor; Capacitance: 10000uF; Voltage: 35V; Case Size: 25x40 mm; Packaging: Bulk Aluminum Snap-In Capacitor; Capacitance: 4700uF; Voltage: 35V; Case Size: 25x25 mm; Packaging: Bulk Aluminum Snap-In Capacitor; Capacitance: 5600uF; Voltage: 35V; Case Size: 22x35 mm; Packaging: Bulk Aluminum Snap-In Capacitor; Capacitance: 680uF; Voltage: 450V; Case Size: 35x50 mm; Packaging: Bulk Aluminum Snap-In Capacitor; Capacitance: 8200uF; Voltage: 16V; Case Size: 22x25 mm; Packaging: Bulk Aluminum Snap-In Capacitor; Capacitance: 390uF; Voltage: 450V; Case Size: 30x40 mm; Packaging: Bulk Aluminum Snap-In Capacitor; Capacitance: 12000uF; Voltage: 35V; Case Size: 25x45 mm; Packaging: Bulk CAPACITOR, 6800UF 35V CAPACITOR, 6800UF 35V; CAPACITANCE:6800UF; VOLTAGE RATING, DC:35V; CAPACITOR DIELECTRIC TYPE:ALUMINIUM ELECTROLYTIC; SERIES:LLS; TEMP, OP. MAX:85(DEGREE C); TEMP, OP. MIN:-40(DEGREE C); TOLERANCE, :20%; RoHS Compliant: Yes Aluminum Snap-In Capacitor; Capacitance: 8200uF; Voltage: 35V; Case Size: 22x45 mm; Packaging: Bulk Aluminum Snap-In Capacitor; Capacitance: 270uF; Voltage: 450V; Case Size: 35x25 mm; Packaging: Bulk Aluminum Snap-In Capacitor; Capacitance: 22000uF; Voltage: 16V; Case Size: 25x40 mm; Packaging: Bulk Aluminum Snap-In Capacitor; Capacitance: 22000uF; Voltage: 16V; Case Size: 30x30 mm; Packaging: Bulk
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Electronic Theatre Controls, Inc. List of Unclassifed Manufacturers http://
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0879144816 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 48 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 48 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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Molex Electronics Ltd.
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URA2405LD-15WR2 URB4815LD-15WR2 URA2415LD-15WR2 UR |
DUAL/SINGLE OUTPUT DIP PACKAGING, DC-DC CONVERTER DUAL/SINGLE OUTPUT DIP PACKAGING, DC-DC CONVERTER
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MORNSUN Science& Technology Ltd. MORNSUN Science& Techno...
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AM29F080-150EEB AM29F080-150SEB AM29F080-120FEB AM |
x8 Flash EEPROM 30V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRL3303S with Lead Free Packaging 20V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRL3502S with Lead Free Packaging 75V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRF3808S with Lead Free Packaging 30V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; Similar to IRF3707Z with Lead Free Packaging 75V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; A IRFS3307 with Standard Packaging 30V Single N-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7809AV with Lead Free Packaging 30V Single N-Channel HEXFET Power MOSFET in a D-Pak package; A IRFR3709ZCPBF with Standard Packaging 100V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; A IRFB59N10D with Standard Packaging 30V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; A IRL2703 with Standard Packaging x8闪存EEPROM 55V Single N-Channel HEXFET Power MOSFET in a SOT-223 package; Similar to IRFL024N with Lead Free Packaging x8闪存EEPROM 100V Single N-Channel HEXFET Power MOSFET in a TO-220 FullPak (Iso) package; Similar to IRFI530N with Lead Free Packaging
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Amphenol, Corp.
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AM29L516DC AM29L517DC AM29L517AXC AM29L517/BXC AM2 |
Dimming Ballast Control, Brown-out Protection, Programmable Preheat Time, 1.8us Deadtime in a 16-lead SOIC Narrow package; A IR21593S with Standard Dimming Ballast Control, Brown-out Protection, Programmable Preheat Time, 1.8us Deadtime in a 16-lead SOIC Narrow package; A IR21592S with Tape Dimming Ballast Control, Brown-out Protection, Programmable Preheat Time, 1.8us Deadtime in a 16-lead SOIC Narrow package; A IR21592S with Standard Half Bridge Driver, LO In Phase with RT, Programmable Oscillating Frequency, 0.6us Deadtime in a 8-lead SOIC package and different phase; Similar to IR21531S with Lead Free Packaging Hi-Rel DC-DC Standard Dual Converter in a ATR package; A ATR2815D with Standard Packaging Ballast Control, Programmable Preheat Time and Run Frequency, Programmable Deadtime in a 14-pin DIP package; A IR2156 with Standard Packaging Hi-Rel DC-DC Standard Triple Converter in a ATR package; A ATR2815T with Standard Packaging Hi-Rel DC-DC Rad-Hard Triple Converter in a ART package; A ART2812T with Standard Packaging 600V Ballast Controller IC with Adaptive Zero-Voltage Switching, Internal Crest Factor Over-Current Protection and an Integrated Bootstrap Diode in a 8-Pin SOIC package.; Similar to IR2520DS with Lead Free Packaging Multiplier 乘数
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Rochester Electronics, LLC
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